The following is a brief summary of our fab capabilities:
— Wafer size: 100 mm (4 inch wafers)
— Clean room specification: Class 1000 (Class 100 under laminar hoods)
Selected fab equipment:
— Perkin-Elmer projection aligners (capable of 3 micron feature size)
— MRC sputtering machine with 3 target capability (SiCr, NiCr, Al)
— Fully automated Thermco diffusion furnaces with SiC cantilever loading
— Wet and dry etching capability
— KOH-based Anisotropic etch bath for V-groove etching
Contact us now to begin discussing your foundry requirements.
and probing
sputtering machines
Perkin-Elmer aligners
diffusion furnace